A surface treatment is a coating applied to the surface of an object by mechanical, chemical, electrochemical or physical means. The aim of this operation is to modify the appearance or surface function of materials. From self-cleaning car windshields, anti-reflective, anti-scratch and anti-fog spectacle lenses... to antibacterial medical prostheses, surface treatments are used in the vast majority of everyday objects.
Plasma is a state of matter in the same way as solid, liquid or gaseous states. There is no phase transition from one of these states to plasma and vice versa. It's matter in the form of ions and electrons that is electrically neutral overall. On Earth, it is visible in its natural state at high temperatures to promote ionization, the best-known example being lightning.
In industrial applications, plasma is used for three types of reaction: - Surface cleaning: plasma technologies are used to remove any contamination present on the surface of a material, whether organic or hydrocarbon in nature. - Surface activation: plasma is used to modify the nature of a material's surface by adding atoms or molecules. The polarity of the surface is increased, and its adhesive wettability is improved, to enhance the adhesion of glue, varnish, paint, etc. - Plasma thin-film deposition is used to cover surfaces to be functionalized with an ultra-thin coating.
Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS) will enable chemical evaluation of these thin films. This highly sensitive method of elemental and molecular analysis of the extreme surface (' 1 nm) is a valuable source of information for characterizing these deposits. The profile mode gives access to in-depth distribution chemistry down to 20 µm by alternating analysis and abrasion cycles with an Argon cluster (GCIB) for organic materials, or a Cesium (Cs+) or Oxygen (O2+) gun for inorganic materials.
By alternating acquisition and abrasion sequences, a composition profile can be traced with nanometric depth resolution. The primary ion beam, reduced to a small diameter spot, scans the surface to be imaged. The secondary optics for extraction and mass analysis are fixed. The image is reconstructed by synchronizing the secondary signal with the primary beam scan. Lateral image resolution depends on the size of the micro-beam (from 100 nm to 3 µm in diameter, depending on analysis conditions).
No preparation was carried out.
ToF-SIMS analysis in profile mode is performed via analysis/abrasion cycles with an argon cluster source. The profile is acquired over a depth of 1.5 µm and an area of 400 x 400 µm2, with one image every 10 abrasion scans. Figure 1 shows the chemical profile of the ions of interest on the substrate (silicon wafer) and the various coatings deposited on its surface. A first silicon top coat layer of around 100 nm is observed. A 1 µm barrier coating is then detected, this plasma deposit of 40 thin layers is of organic nitrogen composition. Carbon ions show 40 peaks spaced at around 23 nm in the barrier layer. A 200 nm adhesion layer separates this barrier from the silicon-only substrate, visible from a depth of 1.2 µm. Figure 2 and 3 show lateral reconstructions in 2 and 3 dimensions. Figure 2 shows a 2D view of the lateral section of the substrate covered with different layers. These images show each of the 40 deposits making up the barrier layer. It is worth noting the very good z-resolution of this imagery, making it possible to distinguish each of the layers spaced 23 nm apart.
In other work, ToF-SIMS has been used to map 2D and 3D contaminants on the surface of technical parts.