Scanning Electron Microscope (SEM)

SEM is a versatile multifunctionnal tool which allows to get images of the material's surface structure and morphology with a few nm resolution; it also gives a qualitative (BSE) and quantitative (EDX, lateral resolution around 1µm) chemical information. Tescan Analytics uses 3 TESCAN equipments : 2 FEG sources (FERA and LYRA), and 1 Tungsten source (VEGA) with variable pressure option. 

Samples analyzed: all kinds of materials
Insulators (Flood gun), polymers, organic products, biological samples, powders, galss, semiconductor, metal, alloys

Have a look into a gallery full of real applications.


TESCAN - FERA3 and LYRA3 - FEG source, EDX, EBSD

TESCAN FERA3 and LYRA3 have both high performance FEG SEM system, featuring a high brightness Schottky emitter for achieving high resolution and low-noise imaging. These SEM equipments are used to analyze all types of materials, offering all the advantages that come with the latest technologies and developments in SEM.  These equipments are equipped wit EDX and EBSD detectors : 
  • Energy Dispersive X-ray Spectroscopy (EDX) is a technique in which characteristic X-rays generated from the electron beam-sample interaction are analysed to provide elemental composition of the sample in the form of spectra (histograms) in which individual elements can be identified. Peaks in the EDX spectra correspond to characteristic X-rays lines from a specific element. Thus, the spectra provide quantitative chemical characterisation of the samples.
  • Electron backscatter diffraction (EBSD) is a microanalytical technique for SEM to study crystal structure and crystal orientation of sample surface down to nanoscale. EBSD provides valuable information on crystalline and polycrystalline specimens that help researchers characterise and understand properties of materials. The EBSD  provides information about local crystal orientation, phase, characterisation of grain morphology, grain boundary, as well as orientation texture, internal stresses and defects in samples and many others can be determined with this microanalytical technique. 
The two systems are also coupled with FIB : focused ion beam scanning electron microscopes (FIB-SEMs) open up a world of new capabilities enabling applications which would otherwise not be possible to achieve with either standalone systems. The configuration in the FIB-SEM systems is such that the electron and ion beam focal points coincide, which results in the optimisation of many applications. This feature enables simultaneous SEM imaging during FIB milling tasks - a significant leap in terms of performance and throughput in all those FIB operations which demand extremely high level of precision. 
 
  • Electron source : High brightness Schottky emitter
  • Resolution 1,2 nm at 30keV
  • BSE resolution 2 nm à 30keV
  • Magnification at 30keV 1x – 1 000 000x
  • Maximum imaging field : 6,0 mm (working distance 9 mm) ; 17 mm (working distance 30 mm)
  • BDT : 200 eV to 30 keV
  • Tip current : 2 pA à 200 nA

TESCAN - VEGA3 - W source, EDX

TESCAN VEGA3 is a thermionic emission SEM system that comes either with tungsten heated filament or lanthanum hexaboride (LaB6) as electron source. VEGA3 is a versatile system intended for both low and high vacuum operations. 
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                                                   VEGA 3 - TESCAN